Design And Reuse, The System-On-Chip Design Resource - IP, …
Kudelski IoT Launches Quantum-Resistant Security IP, Future-Proofing Semiconductors Against Emerging Quantum Threats. Silicon Creations Celebrates Milestone with Delivery of 1,000th …
Understanding the Importance of Prerequisites in the VLSI Physical ...
At the heart of VLSI lies the intricate process of physical design, a crucial step that transforms logical circuit representations into tangible semiconductor chips. This article delves into the …
D&R Silicon IP Catalog: Directory of Semiconductor IP - Design …
2 different packages with or without vector: A46MPV, A46MP. in-order dual-issue 8-stage CPU core with up to 256-bit VLEN. Symmetric multiprocessing up to 16 cores. MIPI C-PHY v2.0 /D …
D&R Industry Expert Blogs - Design-Reuse.com
D&R Industry Expert Blogs. This section features posts from around the Web by authors with passion, integrity, authority, and community support in the IP / SoC industry.
System Verilog Assertions Simplified - Design And Reuse
System Verilog Assertions Simplified. By Smit Patel, eInfochips. Abstract. Assertion is a very powerful feature of System Verilog HVL (Hardware Verification Language). Nowadays it is …
SRC-Pro : 24-bit -130dB THD+N Multi-Channel Audio …
The ASRC-pro can perform common sample rate conversions with less than -130 dB of Total Harmonic Distortion plus Noise (THD+N) and has a Dynamic range of 131 dB, supporting …
System Verilog Macro: A Powerful Feature for Design Verification …
SV macro is one of the most powerful features out there and if used properly with a thorough understanding and applied wisely in a DV project, it can help to save a lot of time and can …
Design Rule Checks (DRC) - A Practical View for 28nm Technology
This whole process is called Design Rule Checking (DRC). There are many design rules at different technology nodes, a few of which are mentioned below. Types of DRCs: Minimum …
GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS …
Jan 9, 2024 · UCIe 32G chiplet interface provides industry leading bandwidth density 10 Tbps per 1mm of die edge (5 Tbps/mm full-duplex). The chip uses TSMC’s N3P silicon process and …
UVM RAL Model: Usage and Application - Design And Reuse
UVM RAL is an object-oriented model for registers inside the design. To access these design registers, UVM RAL provides ready-made base classes and APIs. Some of the RAL model …